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Promising filler for electric-packaging materials
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2007
Conference Paper
Title
Promising filler for electric-packaging materials
Title Supplement
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Author(s)
Bauer, M.
Vieth, S.
Uhlmann, M.
Landeck, S.
Mainwork
MicroNanoReliability 2007, 1st World Congress MicroNanoReliability
Conference
World Congress MicroNanoReliability 2007
International Congress on Microreliability and Nanoreliability in Key Technology Applications (MNR) 2007
Language
English
EPC