October 5, 2015
Conference Paper
Title

Silicon photonics packaging on board-level

Abstract
The ongoing development focuses on low-loss single-mode glass waveguide panel integration in multi-layer electro-optical circuit boards (EOCB) and optical interconnection by micro-optics to the grating couplers of such assembled silicon photonic chips.
Author(s)
Brusberg, Lars
Weber, D.
Pernthaler, D.
Mukhopadhyay, B.
Böttger, G.
Schröder, H.
Tekin, T.
Mainwork
Conference
DOI
Language
English