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  4. Memory Array Demonstration of fully integrated 1T-1C FeFET concept with separated ferroelectric MFM device in interconnect layer
 
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2022
Conference Paper
Title

Memory Array Demonstration of fully integrated 1T-1C FeFET concept with separated ferroelectric MFM device in interconnect layer

Abstract
In our work we describe and demonstrate an alternative approach of integrating 1T-1C FeFET having separated transistor (1T) without modifying frontend CMOS technology and an additional gate-coupled ferroelectric (FE) capacitor (1C) embedded in the interconnect layers. Starting from the results of FE capacitor integration and 1T-1C single cell characterization this paper describes realization and results of a fully integrated 8 kbit memory array implementation.
Author(s)
Seidel, Konrad  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Lehninger, David
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Hoffmann, Raik  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Mähne, H.
X-FAB Dresden GmbH & Co. KG
Ali, Tarek Nadi Ismail  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Revello Olivo, Ricardo Orlando
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Lederer, Maximilian
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Bernert, K.
X-FAB Dresden GmbH & Co. KG
Biedermann, Kati  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Thiem, S.
2X-FAB Dresden GmbH & Co. KG
Mertens, Konstantin
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Heinig, Andreas  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Landwehr, Matthias  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Shen, Yukai
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Wang, Defu
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Kämpfe, Thomas  orcid-logo
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Mainwork
Symposium on VLSI Circuits and Technology 2022. Digest of Technical Papers  
Project(s)
Embedded storage elements on next MCU generation ready for AI on the edge  
Technology and hardware for neuromorphic computing  
Funding(s)
H2020  
Funder
European Commission  
European Commission  
Conference
Symposium on VLSI Circuits and Technology 2022  
File(s)
Download (1.22 MB)
Rights
Use according to copyright law
DOI
10.1109/VLSITechnologyandCir46769.2022.9830141
10.24406/h-427213
Language
English
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Keyword(s)
  • FeFET

  • ferroelectric memory

  • hafnium oxide

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