Reliability Analysis of Surface Mount Interconnect Technologies Suitable for Temperatures Up to 200°C

In recent years there has been an increased need for high-temperature-resistant electronics both in power electronics and in robust sensor systems for industrial applications. This is often linked to the development of new materials and technologies. However, there are a number of applications where the use of SMT or THT-compatible components and interconnect technologies is an alternative for both cost reasons and the load scenario. This paper presents reliability studies for the manufacturing of high-temperature-resistant electronics in SMT assembly based on commercial components for the isothermal load case of 200°C. The evaluation criteria include both the electrical properties and the consideration of the shear strengths with the associated fracture patterns.