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  4. Me-DLC based strain sensitive materials
 
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2021
Conference Paper
Title

Me-DLC based strain sensitive materials

Title Supplement
Abstract
Abstract
Sensors are essential component of the digitalization (Internet of Things, Industry 4.0, EL). There are challenges arising in integrating sensors in existing workpieces and machines. Besides the integration boosting the sensitivity is an essential challenge. In the case of strain gauges a gauge factor of 2 is standard. Increasing the sensitivity mostly is connected with higher thermal sensitivity of the investigated materials. Furthermore, the applied process can influence the performance of the sensing materials. Therefore, this contribution will address development of metal containing diamond-like carbon films for strain sensing films with enhanced sensitivity while at the same time considering the thermal coefficient of resistance. As best solution a highly strain sensitive film with low or no thermal sensitivity is desired.
Author(s)
Bandorf, Ralf
Fraunhofer-Institut für Schicht- und Oberflächentechnik IST  
Grein, Maria
Gerdes, Holger  
Correia, Rebeca
Heckmann, Ulrike
Bräuer, Günter  
Mainwork
Eleventh International Conference on HIPIMS 2021. Abstract Book  
Conference
International Conference on Fundamentals and Industrial Applications of HIPIMS 2021  
Link
Link
Language
English
Fraunhofer-Institut für Schicht- und Oberflächentechnik IST  
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