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Consideration of parameter scattering in thermo-mechanical characterization of advanced packages
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1998
Conference Paper
Titel
Consideration of parameter scattering in thermo-mechanical characterization of advanced packages
Author(s)
Winkler, T.
Schubert, A.
Kaulfersch, E.
Michel, B.
Hauptwerk
Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices 1998. Proceedings
Konferenz
Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices 1998
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
