English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Multi-scale materials data for 3D TSV stack performance simulation and model validation
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2013
Conference Paper
Title
Multi-scale materials data for 3D TSV stack performance simulation and model validation
Author(s)
Zschech, E.
Yeap, K.B.
Sander, C.
Muehle, U.
Gall, M.
Sukharev, V.
Mainwork
9th International Conference and Exhibition on Device Packaging, DPC 2013
Conference
International Conference and Exhibition on Device Packaging 2013
Language
English
IZFP-D
