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  4. Multi-scale materials data for 3D TSV stack performance simulation and model validation
 
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2013
Conference Paper
Titel

Multi-scale materials data for 3D TSV stack performance simulation and model validation

Author(s)
Zschech, E.
Yeap, K.B.
Sander, C.
Muehle, U.
Gall, M.
Sukharev, V.
Hauptwerk
9th International Conference and Exhibition on Device Packaging, DPC 2013
Konferenz
International Conference and Exhibition on Device Packaging 2013
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Language
English
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