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  4. Pulsed stress behavior of platinum thin films
 
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2010
Conference Paper
Title

Pulsed stress behavior of platinum thin films

Abstract
Platinum thin film layer's long-term stability, repeatability, fast response time, and wide temperature range make it a useful choice in many applications. As a result, platinum resistance temperature devices (RTD) are known as the most reliable standard available for temperature measurements. In this paper we focus on the pulsed stress behavior of the platinum thin film layer, used as a conductive layer for heating and temperature sensing and the stability of the resistive properties. During pulsing, in situ monitoring of temperature generation was possible.
Author(s)
Bonfert, D.
Gieser, H.
Bock, K.
Svasta, P.
Ionescu, C.
Mainwork
IEEE 16th International Symposium for Design and Technology in Electronic Packaging, SIITME 2010  
Conference
International Symposium for Design and Technology of Electronics Packages (SIITME) 2010  
DOI
10.1109/SIITME.2010.5651534
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
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