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  4. ASIC chip, hybrid multisensor and package co-design for smart gas monitoring module
 
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1998
Conference Paper
Title

ASIC chip, hybrid multisensor and package co-design for smart gas monitoring module

Author(s)
Reczey, M.
Dobay, R.
Harsanyi, G.
Illyefalvi-Vitez, Z.
Stehen, J. van den
Vervaet, A.
Reinert, W.
Urbancik, A.
Guljajev, A.
Visy, C.
Barsony, I.
Mainwork
IEEE International Workshop on Chip Package Codesign 1998. Proceedings  
Conference
International Workshop on Chip Package Codesign (CPD) 1998  
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT  
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