English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Have you forgotten your password?
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
ASIC chip, hybrid multisensor and package co-design for smart gas monitoring module
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
1998
Conference Paper
Title
ASIC chip, hybrid multisensor and package co-design for smart gas monitoring module
Author(s)
Reczey, M.
Dobay, R.
Harsanyi, G.
Illyefalvi-Vitez, Z.
Stehen, J. van den
Vervaet, A.
Reinert, W.
Urbancik, A.
Guljajev, A.
Visy, C.
Barsony, I.
Mainwork
IEEE International Workshop on Chip Package Codesign 1998. Proceedings
Conference
International Workshop on Chip Package Codesign (CPD) 1998
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT