Optimization parameters for laser-induced forward transfer of Al and Cu on Si-wafer substrate

The research goal is to perform a laser-writing study to deposition of micro/nano particles on the substrate as interconnection usage. The threshold of laser energy, pulses per laser shot, as well as pulse overlapping is crucial to achieve the best deposition results possible. The present study aims to the novel technique by laser deposition of Aluminium and Copper nano particles on silicon wafer substrate. Thin µm films have been deposited from one-side coated glass to Silicon wafers by sputtering nano particles using laser radiation. Distance between donor film and substrate (e) was up to several 100 µm and it has been optimized as 300 µm. A step-by-step optimization guide for deposition parameters were first developed and presented. The identification of laser energy threshold, pulses per laser shot, in addition to pulse overlapping is essential if the best deposition results are going to be drawn by laser direct writing method. This technique is regarded as the most important direct-write alternative for lithographic processes in order to generate patterns with high-resolution.