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  4. Topographic electrical characterization of semi-insulating GaAs, InP and SiC substates
 
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2002
Conference Paper
Title

Topographic electrical characterization of semi-insulating GaAs, InP and SiC substates

Other Title
Topographische elektrische Charakterisierung semi-isolierender GaAs-, InP- und SiC-Substrate
Abstract
Contactless mapping of the resistivity and contactless evaluation of the electron mobility of semi-insulating compound semiconductor substrates is achieved with the time-dependent capacitive measurement technique. High resolution images of state-of-the-art and exploratory substrates are presented, showing the absolute value and lateral variation of the resistivity in the range 10(exp 5) to 10(exp 12) ohmcm. The topograms exhibit characteristic macro- and mesoscopic variation patterns related to the growth procedure as well as structural inhomogeneities and defect concentration variations. Very satisfactory agreement between conventional Hall data and mobility data measured with the innovative technique is obtained.
Author(s)
Stibal, R.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Müller, Stefan  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Jantz, W.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Mainwork
CS-MAX 2002. Compound Semiconductor Manufacturing Expo  
Conference
Compound Semiconductor Manufacturing Expo (CS-MAX) 2002  
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • semi-insulating

  • semi-isolierend

  • resistivity

  • spezifischer Widerstand

  • topography

  • Topographie

  • GaAs

  • InP

  • SiC

  • substrat

  • wafer

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