The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs

A method is presented to create a validated scheme for the virtual prototyping of System-in-package (SiP) products based on fan-out-wafer-level-packaging (FOWLP) technologies. It involves the material characterization of molding compound by dynamic mechanical analysis, warpage measurement of a package using MicroProf measurement system, finite element (FE) analyses using a parametric FE model of an automotive inertial sensor created by modular system of models in ANSYS, model validation and sensitivity analyses using optiSLang. In order to prevent the fracture in copper pad metallization and solder ball, a new optimization criteria is defined based on interface stresses in order to optimize different geometry parameters like thickness and diameter of under bump metallization (UBM) and pad.