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New generation of electrostatic carrier technology (T-ESC) for reversible thin wafer clamping with seal glass bonding
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2011
Conference Paper
Title
New generation of electrostatic carrier technology (T-ESC) for reversible thin wafer clamping with seal glass bonding
Title Supplement
Abstract
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Author(s)
Balaj, I.
Raschke, R.
Baum, Mario
Uhlig, Sven
Wiemer, Maik
Geßner, Thomas
Mainwork
WaferBond 2011, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts
Conference
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) 2011
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
