Influence of flexible multibeam intensity distributions on selective laser-induced etching process regimes

The precision and versatility of selective laser-induced etching in fused silica render it indispensable for many applications in medical engineering, the semiconductor industry, and quantum technology. However, its process-limited productivity renders it unsuitable for a wider set of applications, particularly those that require cost-effective solutions. As the process is largely concerned with microprocessing applications, a promising method to enhance process efficiency is through parallelization using multiple beams with high packing density. This study examines the dynamics of flexible multibeam intensity distributions relative to the number of beamlets and spacing. The study identifies stable process regimes, examines the increased absorption from interactions among parallel modified tracks, and develops a strategy for optimized processing using flexible multibeams. The final demonstration illustrates the generation of multibeam fabricated through glass vias with varying degrees of complexity.