A concept for the analysis of cross sensitivities in modern RFID systems

In this paper, a concept for the analysis of various cross sensitivities in RFID systems is described. A modern RFID transponder system consists of several analog blocks, a digital section, and possibly sensors. These components influence each other by different parasitic effects, such as substrate coupling, thermal coupling, capacitive coupling, latch up effect, etc. All those effects are called cross sensitivities. This paper introduces various cross sensitivities in modern micro systems such as RFID transponder systems, from the outside environment to the inside parasitic effects. The parasitic effects can be avoided or reduced by many methods in architecture, technology, layout, or circuit design. The common preventive measures against those cross sensitivities will also be presented in this paper. Then, this paper focuses on the thermal coupling and temperature gradient on the chip. How the heat from a power device dissipates through the substrate and which effects or influences there are at the devices lying near the power device are also described.