New system for fast submicron optical direct writing

We report on a new system for fast submicron optical direct writing of photoresist pattern on silicon wafers and substrates. So far direct writing on wafers based on scanning of either electron or laser beams plays only a negligable role in todays semiconductor manufacturing even for short cycle time low volume fabrication due to the comparatively low throughput, the high cost of ownership and the complexity of state of the art systems. We have developed a new system for laser direct writing that promises good throughput, good imaging performance and economic costs of investment and ownership.