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Fan-out and embedded panel discussion: Embedded technology and latest developments
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2011
Conference Paper
Title
Fan-out and embedded panel discussion: Embedded technology and latest developments
Author(s)
Böttcher, L.
Mainwork
IMAPS International Conference and Exhibition on Device Packaging
Conference
International Conference and Exhibition on Device Packaging 2011
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
