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  4. Packaging-Codesign for the development of a high-resolution MIMO-Radar-Module for Automated guided vehicles
 
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2024
Conference Paper
Title

Packaging-Codesign for the development of a high-resolution MIMO-Radar-Module for Automated guided vehicles

Abstract
Compact radar systems with the ability to detect objects in space (4D radar) with high resolution (4o azimuth, 6o elevate) require at least 144 channels. 1 channel is equivalent to the combination of a transmitter and a receiver antenna. Radar modules for use in 3D radar with 12 channels are state of the art. The article shows how such systems can be realized cost-effectively by cascading 3D radar modules. Such an approach places high demands on the packaging technology for both functional and size reasons. In order to select the appropriate technology and to consider the technology-related influences of the packaging on the function of a radar module, a packaging codesign approach is presented, which disassemble the five steps of setting up the requirements (1), disassemble the radar module into functional assemblies (2), creating an architecture (3) and technology concept (4) and codesign phase (5) and leads the designer successively to the final layout. Finally, the realization of a radar module for a driverless transport system is used to show that the method presented is highly likely to lead to functional radar modules in the first step.
Author(s)
Tschoban, Christian  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Pötter, Harald  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Perlwitz, Paul
Technische Universität Berlin
Dreissigacker, Marc
Technische Universität Berlin
Müller, Friedrich
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Becker, Karl-Friedrich  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Ndip, Ivan  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schneider-Ramelow, Martin  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Mainwork
26th Electronics Packaging Technology Conference, EPTC 2024. Proceedings  
Conference
Electronics Packaging Technology Conference 2024  
DOI
10.1109/EPTC62800.2024.10909937
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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