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1999
Conference Paper
Title
Packaging of OEICs with tapered fibers for optical communications systems with up to 45 GHz modulation bandwidth
Abstract
We designed and fabricated a series of modules for one-sided and double-sided fiber-chip coupling of waveguide-fed InP and GaAs OEIC such as diode lasers, semiconductor amplifiers and optical modulators. Simultaneous coupling of both chip sides to the fiber is possible with a new patented set-up. The modules are temperature-controlled within an ambient temperature range from -10 degrees C to +50 degrees C and electrical modulation signals up to 45 GHz can be fed via RF connectors to the OEIC. The coupling loss is typically less then 3 dB with tapered fibers. The package shows good long-term stability and is well-suited for prototypes and small-scale production.
Language
English
Keyword(s)
electro-optical modulation
gallium arsenide
indium compounds
integrated optoelectronics
module
optical couplers
optical fibre communication
optical receiver
optical transmitter
packaging
semiconductor optical amplifier
tapered fiber
optical communication systems
fibre-chip coupling
waveguide-fed oeic
InP
GaAs
diode laser
semiconductor amplifiers
optical modulator
simultaneous coupling
electrical modulation
rf connectors
long-term stability
-10 to 50 degc