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  4. Packaging of OEICs with tapered fibers for optical communications systems with up to 45 GHz modulation bandwidth
 
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1999
Conference Paper
Title

Packaging of OEICs with tapered fibers for optical communications systems with up to 45 GHz modulation bandwidth

Abstract
We designed and fabricated a series of modules for one-sided and double-sided fiber-chip coupling of waveguide-fed InP and GaAs OEIC such as diode lasers, semiconductor amplifiers and optical modulators. Simultaneous coupling of both chip sides to the fiber is possible with a new patented set-up. The modules are temperature-controlled within an ambient temperature range from -10 degrees C to +50 degrees C and electrical modulation signals up to 45 GHz can be fed via RF connectors to the OEIC. The coupling loss is typically less then 3 dB with tapered fibers. The package shows good long-term stability and is well-suited for prototypes and small-scale production.
Author(s)
Fischer, U.H.P.
Peters, K.
Ziegler, R.
Pech, D.
Kilk, A.
Mekonnen, G.G.
Jacumeit, G.
Mainwork
European Conference on Networks and Optical Communications 1999 (NOC '99). Proceedings. Vol.1: Broadband access and technology  
Conference
European Conference on Networks and Optical Communications (NOC) 1999  
Language
English
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Keyword(s)
  • electro-optical modulation

  • gallium arsenide

  • indium compounds

  • integrated optoelectronics

  • module

  • optical couplers

  • optical fibre communication

  • optical receiver

  • optical transmitter

  • packaging

  • semiconductor optical amplifier

  • tapered fiber

  • optical communication systems

  • fibre-chip coupling

  • waveguide-fed oeic

  • InP

  • GaAs

  • diode laser

  • semiconductor amplifiers

  • optical modulator

  • simultaneous coupling

  • electrical modulation

  • rf connectors

  • long-term stability

  • -10 to 50 degc

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