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  4. Solderjet bumping for the assembly of optical fibers
 
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2009
Conference Paper
Title

Solderjet bumping for the assembly of optical fibers

Abstract
Further miniaturization of 3D-integrated hybrid optical systems on smart system platforms requires a fast and flexible joining technology that overcomes limitations of standard bonding processes in optics. Laser-based solder bumping with its complete integration of solder alloy preform handling, reflowing and application of the solder volume simplifies the joining process and enables for flux-free soldering of micro-optical components with localized and time restricted energy input within a local nitrogen atmosphere. Solder joints provide increased mechanical strength, a higher long term, thermal and radiation stability and good thermal and electrical conductivity compared to polymeric adhesives commonly used for optical bonding. A demonstrator system of a fiber-coupling unit using a polarization maintaining optical fiber (PMF) that is soldered to a V-groove by solderjet bumping with submicron accuracy is described in this work. The development of a device for batch PVD-metallization of the fibers for the creation of necessary wetting surfaces and a miniaturized mechanical gripper enabling for both translational adjustment and the axial alignment of the fiber at the joining geometry is reported.

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Further miniaturization of 3D-integrated hybrid optical systems on smart system platforms requires a fast and flexible joining technology that overcomes limitations of standard bonding processes in optics. Laser-based solder bumping with its complete integration of solder alloy preform handling, reflowing and application of the solder volume simplifies the joining process and enables for flux-free soldering of micro-optical components with localized and time restricted energy input within a local nitrogen atmosphere. Solder joints provide increased mechanical strength, a higher long term, thermal and radiation stability and good thermal and electrical conductivity compared to polymeric adhesives commonly used for optical bonding. A demonstrator system of a fiber-coupling unit using a polarization maintaining optical fiber (PMF) that is soldered to a V-groove by solderjet bumping with submicron accuracy is described in this work. The development of a device for batch PVD-metallization of the fibers for the creation of necessary wetting surfaces and a miniaturized mechanical gripper enabling for both translational adjustment and the axial alignment of the fiber at the joining geometry is reported.
Author(s)
Burkhardt, T.
Kamm, A.
Beckert, E.
Eberhardt, R.
Buchmann, F.
Tünnermann, A.
Mainwork
VII. ITG-Workshop Photonische Aufbau- und Verbindungstechnik 2009  
Conference
Workshop Photonische Aufbau- und Verbindungstechnik 2009  
Language
English
Fraunhofer-Institut für Angewandte Optik und Feinmechanik IOF  
Keyword(s)
  • micro assembly

  • micro manipulation

  • micro-optical system integration

  • solder bumping

  • laser beam soldering

  • lead-free solder

  • LTCC

  • optical fiber

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