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  4. Embedding electronics into additive manufactured components using laser metal deposition and selective laser melting
 
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2018
Journal Article
Title

Embedding electronics into additive manufactured components using laser metal deposition and selective laser melting

Abstract
The paper deals with the integration of a light emitting diode (LED) into an additive manufactured metal component. Selective laser melting (SLM) and laser metal deposition (LMD) are used. The material used is the chrome-nickel steel 316L. The basic component is manufactured by means of SLM and consists of a solid body and an area with grid structure. The solid body includes a duct in the shape of a groove with a recess for the positioning of the power cable. The LED is embedded in the grid structure via an inlet from the solid body. In further processing, the groove is filled with LMD. Two strategies with different parameter combinations were investigated. It shows that a high energy input near the power cable leads to its destruction. By using multiple parameter combinations during the manufacturing process, this destruction can be prevented. There was a comparison of both strategies with regard to the necessary number of tracks and duration of welding time.
Author(s)
Petrat, Torsten
Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK  
Kersting, Robert
Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK  
Graf, Benjamin
Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK  
Rethmeier, Michael  
Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK  
Journal
Procedia CIRP  
Conference
International Conference on Photonic Technologies 2018  
Open Access
File(s)
Download (627.56 KB)
Rights
CC BY-NC-ND 4.0: Creative Commons Attribution-NonCommercial-NoDerivatives
DOI
10.1016/j.procir.2018.08.071
10.24406/publica-r-254520
Additional link
Full text
Language
English
Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK  
Keyword(s)
  • additive manufacturing

  • condition monitoring

  • process chain

  • laser metal deposition

  • Selektive Laser Melting

  • embedded electronic

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