Optimized process sequences for prototyping of molded interconnect devices

The MID technology offers a high potential for the development of innovative integrated product solutions. The integration of mechanical and electronic functions on a spatial circuit board allows the realization of modules with a high functional density and a significant degree of miniaturization. MID components are spatial injection molded parts, with their surface selectively patterned and metalized. The conventional production of MID applications by an injection molding process is time consuming and expensive. Therefore, the efforts of industry and research show the significance of MID prototyping. Our objective was to develop process overviews and matching sequences for the methodological-assisted prototyping within our MIDLaboratory (MIDLab). First of all, we developed process overviews for any suitable process operations in accordance to the MID reference process. To enable a methodological approach in the production planning, essential information has been summarized in characteristics. The characteristics include a short description of the process and its unique features and a summary of the advantages and disadvantages compared to alternative methods. In addition, the compatibility of subsequent process steps, if limited or restricted, is illustrated. Afterwards, these process steps were combined to production sequences with a focus on costs, benefits and house production. Based on the requirements of the prototype, two scenarios have been developed, covering a wide spectrum of possibilities. In both sequences emphasis has been placed on cost-optimal combinations with a high house production rate. The validation of the results was carried out by two application examples. For this reason demonstrators were designed. On the basis of these modules, the results of the developed process chains were validated.