Multilayer photoresist stamps for selective plasma treatment in micrometer scales

A novel plasma stamp has been developed allowing selective plasma treatment and coating of flat surfaces using dielectric barrier discharges at atmospheric pressure. The stamp consists of a flat carrier material covered with photoresist. The resist is structured to form cavities in which the plasma is burning. The cavity footprint is the desired structure to be reproduced or "plasma printed" on the substrate. Cavities can have any geometry and widths down to 10 mu m. It is shown that the substrate surfaces can be activated in the same scale as the cavity dimensions and that the treated areas reproduce the footprint of the cavities. To be able to coat surfaces selectively, the stamp consists of multiple resist layers forming a channel network. Using this network, the cavities can be filled with process gas containing polymerizable monomers. This plasma stamp technology introduces a new MEMS process with high potential for production processes and bioscience applications.