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  4. Thermographic Testing Methods with High Temporal and Spatial Resolution
 
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2000
Conference Paper
Title

Thermographic Testing Methods with High Temporal and Spatial Resolution

Abstract
Microstructures in semiconductors and in ferrite were imaged by pulsed thermography and by thermal wave microscopy. The lateral resolution ranges down to 50 µm for thermoagraphy and 5 µm respectively. The advantage of both techniques is their contact-free operation with ability to obtain sub-surface information.
Author(s)
Netzelmann, U.
Walle, G.
Karpen, W.
Meyendorf, N.
Mainwork
MicroMat 2000. Proceedings 3rd International Conference and Exhibition Micro Materials  
Conference
Micro Materials (Micro Mat) 2000  
Language
English
Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP  
Keyword(s)
  • nondestructive testing

  • thermal wave

  • thermography

  • wafer

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