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  4. Transmission lines on flexible substrates with minimized dispersion and losses
 
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2013
Conference Paper
Title

Transmission lines on flexible substrates with minimized dispersion and losses

Abstract
This work describes the characterization of high frequency transmission lines realized on flexible substrates. In order to investigate technology related aspects influencing the performance of the transmission lines the study includes two different technologies. The first one is a commercially available process applying a subtractive layer definition on Polyimide (PI) and Liquid Cristal Polymer (LCP) substrate. The second one is a reel to reel technology applying a semi additive layer definition on PI. The characterization was performed from DC up to 60 GHz and showed for the reel to reel process a higher performance at high frequencies which is mainly attributed to the more precise layer definition.
Author(s)
Wolf, H.
Gieser, H.
Maurer, L.
Mainwork
43rd European Microwave Conference, EuMC 2013. Proceedings  
Conference
European Microwave Conference (EuMC) 2013  
European Microwave Week (EuMW) 2013  
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
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