English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
Temporary adhesive bonding with reconfiguration of known good dies for three-dimensional integrated systems
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2012
Book Article
Title
Temporary adhesive bonding with reconfiguration of known good dies for three-dimensional integrated systems
Author(s)
Klumpp, A.
Ramm, P.
Mainwork
Handbook of wafer bonding
DOI
10.1002/9783527644223.ch17
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
