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A critical review of chip scale packaging
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1997
Conference Paper
Title
A critical review of chip scale packaging
Author(s)
Simon, J.
Auersperg, J.
Reichl, H.
Mainwork
Second International Conference on Chip Scale Packaging 1997. Proceedings
Conference
International Conference on Chip Scale Packaging (CHIPCON) 1997
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
