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A simple model for the mode I popcorn effect for IC packages
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2000
Conference Paper
Title
A simple model for the mode I popcorn effect for IC packages
Author(s)
Alpern, P.
Lee, K.C.
Dudek, R.
Tilgner, R.
Mainwork
Reliability of electron devices, failure physics and analysis
Conference
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) 2000
DOI
10.1016/S0026-2714(00)00116-5
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
