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2016
Conference Paper
Title
ATHENIS-3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology
Other Title
ATHENIS 3D: Automobiltaugliche Hochvolt- und integrierte NVM SoC Plattofrm mit 3D Technologie
Abstract
The ATHENIS-3D FP7 EU project aims at providing new enabling technologies (analog, digital and power components) for high-voltage and high-temperature applications, tested for power systems of new hybrid/electrical vehicles. Innovation is exploited at process/device level (3D chip stacking, wafer level packaging, trench capacitors and TSV-inductors integrated in the interposer, high-reliable non-volatile Magnetic RAM), circuit-level (inductorless high-voltage DC-DC converter, high-temperature 28nm System-on-Chip platform) and system-level (compact 3D embedded power mechatronic system). Enabling high integration levels of complex systems, operating in harsh environments, in a single packaged 3D device, ATHENIS-3D allows for one order of magnitude area reduction vs. today PCB-based power and control systems. Integration costs will be consequently reduced in key industrial sectors for Europe where high-voltage/temperature operations are mandatory (vehicles, avionics, space/defense, industrial automation, energy). © 2016 EDAA.
Author(s)
Language
English
Keyword(s)
3D technology
electric vehicles
integrated passive devices
power electronics
System-on-chip/in-package (SoC/SiP)
Application specific integrated circuits
Automation
Chip scale packages
DC power transmission
DC-DC converters
Electric vehicles
Magnetic levitation vehicles
Power electronics
Programmable logic controllers
System-on-chip
Three-dimensional integrated circuits
Vehicles 3D technology
Enabling technologies