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  4. Electro-Thermal Influence of Interconnection Methods for PTC-Elements on Ceramic Substrates
 
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2025
Conference Paper
Title

Electro-Thermal Influence of Interconnection Methods for PTC-Elements on Ceramic Substrates

Abstract
Positive temperature coefficient (short: PTC) resistors are essential for self-regulating heating systems in electric vehicles. Their thermal connection to an electrically insulating substrate plays a critical role. Typically, PTC elements are glued to ceramic bodies, but these adhesive connections limit the operational temperature range and can lead to uneven current flow. This study investigates two alternative interconnection methods on ceramic substrates like sintering and soldering and comparing their electrothermal effects. Using infrared thermography and impedance spectroscopy to analyze thermos-electrical behavior, and performance under warming and cooling conditions. The findings provide valuable insights for optimizing the thermal management and reliability of PTC-based heater-systems.
Author(s)
Kirchhoff, Mirko
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Barth, Henry  orcid-logo
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Wiedmann, Denis
MAHLE GmbH
Viehrig, Falk
MAHLE GmbH
Rebenklau, Lars  
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Mainwork
PCIM Europe 2025, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management  
Project(s)
Komponentenentwicklung für Hochvoltheizer-Systeme in der Elektromobilität; Teilvorhaben: Entwicklung von Hochvolt-PTC-Heizersystemen  
Funder
Bundesministerium für Wirtschaft und Energie  
Conference
International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management 2025  
DOI
10.30420/566541165
Language
English
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Keyword(s)
  • Adhesives

  • Ceramic materials

  • Cooling systems

  • Integrated circuit interconnects

  • Intelligent robots

  • Temperature

  • Ceramic bodies

  • Ceramic substrates

  • Heating system

  • Insulating substrates

  • Interconnection method

  • Operational temperature

  • Positive-temperature-coefficients

  • Temperature range

  • Thermal

  • Thermal influence

  • Substrates

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