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2011
Book Article
Titel

Popcorn cracking

Abstract
Interface delamination and popcorn cracking are among the most common reasons for mechanical damage in plastic packaging. Many investigations have shown the popcorn phenomenon to be a closely linked process of delamination of the pad/encapsulant interface, moisture diffusion, vapor pressure build-up, and popcorn cracking. A short survey on the phenomenon is given.
Author(s)
Dudek, R.
Hauptwerk
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Thumbnail Image
DOI
10.1007/978-0-85729-236-0_14
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS
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