In-situ analysis of an industrial material compound package by means of X-ray micro tomography and digital volume correlation
The characterization of the thermo-mechanical deformation behavior and failure mechanism plays a central role in reliability evaluations of packaging technology for power electronics. This paper demonstrates the potential of laboratory X-ray micro-computed tomography (X-CT) to characterize the thermo-mechanical behavior of industrial packages through in-situ experiments. A specific thermal loading device offers the possibility to capture deformations and damages of material compounds in a temperature range up to 300°C. Digital volume correlation (DVC) and a novel method based on digital image correlation (DIC) are applied to estimate the deformation field within the specimen at each loaded state as well as the thermal expansion of a specific layer.