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Reliability study of flip chip on FR4 interconnections with ACA
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1999
Conference Paper
Titel
Reliability study of flip chip on FR4 interconnections with ACA
Author(s)
Mießner, R.
Hauptwerk
49th Electronic Components & Technology Conference 1999. Proceedings
Konferenz
Electronic Components and Technology Conference (ECTC) 1999
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
