Verfahren zur trennenden Bearbeitung von Werkstuecken mit einem Laserstrahl

(A1) Die Erfindung betrifft ein Verfahren zur trennenden Bearbeitung von Werkstuecken mit einem Laserstrahl. Das Verfahren kann bei aus einem homogenen Werkstoff gebildetem Werkstueck aber auch bei als Verbundbauteil mit mehreren Werkstoffen gebildeten Werkstuecken eingesetzt werden. Aufgabe der Erfindung ist es, die Bearbeitungsgeschwindigkeit, die Flexibilitaet und die Qualitaet bei der trennenden Bearbeitung von Werkstuecken mit einem Laserstrahl, bei dem ein Werkstoffabtrag ausschliesslich durch Ablation erreicht werden soll, zu verbessern. Bei der Erfindung wird ein fokussierter Laserstrahl mit einer Leistungsdichte im Brennpunkt von mindestens 1 * 10 hoch 7 W/cm2 und einer das Absorptionsvermoegen des abzutragenden Werkstoffs beruecksichtigenden Vorschubgeschwindigkeit von mindestens 150 m/min bis maximal 1200 m/min auf die Oberflaeche eines Werkstuecks zur Ausbildung einer Schnittfuge gerichtet und der Werkstoffabtrag ausschliesslich durch Ablation erreicht.

WO 2009143836 A1 UPAB: 20100101 NOVELTY - The process for separate machining of workpieces using a laser beam, comprises directing a focused laser beam with a power density in the focal point of 1x 107 W/cm2 and a speed of advance, which takes the absorption capacity of the material to be removed into account, of 150 m/min to 1200 m/min onto the surface of a workpiece in order to form a cut notch and purely removing the material by ablation. The laser beam is directed repeatedly on same position of the workpiece surface for a successive material ablation along the cutting edge contour to be formed. DETAILED DESCRIPTION - The process for separate machining of workpieces using a laser beam, comprises directing a focused laser beam with a power density in the focal point of 1x 107 W/cm2 and a speed of advance, which takes the absorption capacity of the material to be removed into account, of 150 m/min to 1200 m/min onto the surface of a workpiece in order to form a cut notch and purely removing the material by ablation. The laser beam is directed repeatedly on same position of the workpiece surface for a successive material ablation along the cutting edge contour to be formed. The laser beam is focused so that the focus point has a diameter of smaller than 100 mu m. The workpiece formed from two materials connected together is processed and at the same time the workpiece ablation is carried out at a material present in the workpiece. The cuttings are formed during the separation and are removed from the workpiece. The processing on the workpiece in which the materials forming the workpiece are connected together in material-fit manner is carried out. The processing is carried out on the workpiece with laser beam absorbing material and laser beam non-absorbing materials that are worn out solely the material absorbing the laser radiation in the area of the cut joint. The feeding speed is kept by 700 m/min and the laser beam is processed in cw-mode. The profiling is adjusted in the laser beam cross-section with height intensities in the external edge area as in its interior. USE - Process for separate machining of workpieces using a laser beam. ADVANTAGE - The process ensures machining of workpieces using a laser beam with improved machining rate, flexibility and quality.