Verfahren zur Herstellung eines elektrooptischen Bauelements

EP 731365 A UPAB: 19961011 The electrooptical component mfg system uses a carrier plate (10) to which electrical structures (16) and an adjustment structure (18) are applied before application of a substrate material. A light waveguide channel (29) is formed in the surface of the substrate using a corresponding-shaped machining tool, which is aligned with the carrier plate via a counter-structure, cooperating with the adjustment structure. The obtained channel is filled with a polymer material for formation of the light waveguide. ADVANTAGE - Allows exact alignment of light waveguides and electrical conductor paths.