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  4. Plasmapolymer-Schichtenfolge als Hartstoffschicht mit definiert einstellbarem Adhaesionsverhalten
 
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Patent
Title

Plasmapolymer-Schichtenfolge als Hartstoffschicht mit definiert einstellbarem Adhaesionsverhalten

Other Title
Plasma-polymer layer sequence as hard material layer with defined variable adhesion characteristics
Abstract
The invention relates to a plasma-polymer layer sequence acting as a hard material layer on substrates, having a function layer as well as an intermediate layer and a gradient layer, whereby the function layer contains non-metallic and submetallic elements of the 1st, 3rd, 4th, 5th, 6th and/or 7th main groups of the periodic system of elements in addition to basic elements, and can be produced using conventional PVD or CVD processors, e.g., a plasma enhanced chemical vapour deposition (PEVCD) process, a possible production variant of this process and some possibilities for their application. This plasma-polymer layer sequence according to the invention is described by the fact that the non-metallic or submetallic elements of the 1st, 3rd, 4th, 5th, 6th and/or 7th main groups of the periodic system of elements contained in the function layer in addition to the basic elements are integrated in the function layer in such a way that the thickness of the polar or disperse components of thes e function layers can be set in a defined manner as a function of the polar or disperse components of the surface energy of the gases, fluids and/or solids with which these layers are in contact and as a function of the desired adhesion characteristic.
Inventor(s)
Trojan, K.
Grischke, M.
Link to:
Espacenet
Patent Number
1993-4317029
Publication Date
2001
Language
German
Fraunhofer-Institut für Schicht- und Oberflächentechnik IST  
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