Verfahren sowie Vorrichtung zum Zusammenfuehren und Fuegen wenigstens zweier dielektrischer Mikrobauteile

The method uses controlled handling of the microcomponents via electric fields, with relative positioning of the microcompnents separated from one another via a liquid or gel of relatively low electrical conductivity. One of the microcomponents is fixed in position via the electrical field provided by a holding and positioning electrode device (20), a further microcomponent controlled via a dynamic electrical field, for positioning and fixing relative to the first microcomponent. USE - For assembly of hybrid microsystems, e.g. dielectric motors etc., having dimensions of the order of tenths of millimetres.