Chipstruktur mit einer Vorrichtung zum Kontaktieren und Halten derselben

The invention relates to a device for bonding and holding of the same, having a chip structure as described in German patent 4345219, said device comprising at least one contact pad on one of its main surfaces. In order to produce an electrical and a mechanical connection, the device comprises a contact pin and a cut-out in the chip structure on the wall of which the contact pad is arranged, whereby the wall is designed in such a way that it forms a clamping connection with the contact pin when it is introduced in the cut-out, whereby the contact pad is pressed against the contact pin. Another design of said device permits a mechanical support of the contact pin in relation to the main surface of the chip structure by using a supporting structure which is provided in the area of the contact pin.