Vorrichtung zum Zerteilen von Koerpern

DE 20202374 U UPAB: 20020903 NOVELTY - A device for dividing wafers from semiconducting single crystal blocks comprises a separating unit (1) and an etching agent feed unit. Separating gaps (9) are created in separating tools (3) between separating foils (12) used to separate each wafer. DETAILED DESCRIPTION - Preferred Features: The device further comprises a foil holder for each separator foil. The foils are made from a material that is resistant to the etching agent used and electrical potentials applied. The separating tool is formed as a wire. USE - Used in the semiconductor chip industry. ADVANTAGE - Very thin wafers can be produced.