Verfahren zur Beschichtung von sub-Mikrometerstrukturen und seine Anwendung

Submicrometer structures are coated by cathodic sputtering or vaporising a target material in a high or low vacuum chamber with a carrier inert gas going past the target, collecting the vapour material and transporting it perpendicularly onto the surface to be coated. USE - Coating highly integrated circuits. ADVANTAGE - The bottom and sides of small surface depressions are coated at high speed without the depressions becoming fully filled in.