Kuehlkoerper mit einer Montageflaeche fuer ein elektronisches Bauteil

The basis for of the heat sink is provided by an upper copper layer (2),an intermediate layer [3), an intermediate layer (3) and a lower copper layer (4). The copper layers are 50 micron thick and the intermediate layer is 300 micron thick and is of molybdenum, tungsten, aluminium nitride or other material with a thermal conductivity of greater than 100 W/m.degree K. On the upper surface is a mounting region that has a solder layer (5) and under this is an oxygen free copper area. Access points (7) to fluid cooling channels are provided. ADVANTAGE - Expansion coefficient matches mounted component.