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Patent
Title

Magnetron-Sputterquelle

Other Title
Magnetron sputter source
Abstract
The magnetron sputter source is used in HV and UHV coating systems and is primarily employed in the form of a two-ring sputter source for coating large round substrates. The sputter source consisting of a magnet system (7), a cooled target (5) and an anode (6) is designed so that a cooling plate (4) with the target (5) attached to it is arranged on a base plate (1). The anode (6) surrounding the target (5) is attached to the base plate (1). The base plate (1) closes an opening in the recipient vacuum-tight, thus attaching the magnet system (7) on the base plate (1) on the atmosphere side. The connections (9) for the cooling water are routed through the base plate (1) insulated.
Inventor(s)
Holfeld, A.
Link to:
Espacenet
Patent Number
1991-4127260
Publication Date
1992
Language
German
Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik FEP  
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