Verfahren und Vorrichtung zum Bestuecken und Loeten von dreidimensionalen Leiterplatten

A process and a device are proposed for equipping and soldering free-formed three-dimensional printed circuit boards. Thereby, the printed circuit board is manipulated by an industrial robot and positioned in relation to fixed processing stations, whereby solder paste is applied to the required position on the printed circuit board, the component previously placed in a universal fetch position is inserted and then soldered. In order to eliminate the influences of gravity with inclined subareas, the printed circuit board is oriented by the industrial robot in such a way that the working position is horizontal for a component to be subsequently equipped.