Verfahren und Vorrichtung zur Herstellung einer Polymerelektronik

The method involves applying a layer web (10) made of a layer material (18) with certain width (b10) predetermined by a layout of a polymer electronics on a carrier (12) by a nozzle (14) by applying a liquid layer material through an exhaust opening (16) and curing the liquid layer material on the carrier. The nozzle is provided with the exhaust opening whose width (b16) depends on width of the layer web. The carrier is moved relative to the nozzle in direction along the applied layer web by rotating a roller. The exhaust opening is closed during reaching of length (l10) of the layer web. The layer material is selected from dielectric, organic p-type semiconductor material and/or organic n-type-semiconductor material. An independent claim is also included for a device for manufacturing a polymer electronics.