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  4. LOESUNG UND VERFAHREN ZUM STROMLOSEN ABSCHEIDEN VON GOLDSCHICHTEN
 
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Patent
Title

LOESUNG UND VERFAHREN ZUM STROMLOSEN ABSCHEIDEN VON GOLDSCHICHTEN

Other Title
Solution for current-less gold plating.
Abstract
NOVELTY - A solution for current-less gold plating contains, as gold(I) compound, complex(es) of Au(I) ions with amino-acids showing a complex-forming constant for Au(I) ions of at least 1010 or with salts of such acids, or the amino-acid (and/or salt) is an additional component in a solution containing Au(I) compound, reducing agent and solvent. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a current-less gold-plating process comprising: (1) coating the workpiece with a catalytic layer for current- less metal plating; and (2) treating the workpiece with the above solution. USE - For gold-plating printed circuit boards and semi- conductor circuits (claimed). ADVANTAGE - Enables the deposition of gold (or palladium etc.) from acid bath solutions at low temperature (e.g. room temperature) at a rate of more than 1 micron/hour. These solutions also show a stability (towards self-decomposition) which is not less than that of known systems.
Inventor(s)
Scheel, W.
Hannemann, M.
Schmidt, R.
Mueller, J.
Meyer, H.
Rehak, W.
Link to Espacenet
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=19745601A
Patent Number
1997-19745601
Publication Date
2001
Language
German
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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