Title

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021

Title Supplement

October 26-28, 2021 Virtual, Online

Corporate Author

American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division

Publisher

ASME

Publishing Place

New York/NY.

Publication Date

2021

ISBN

978-0-7918-8550-5

Conference