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International Symposium on High Density Packaging and Microsystem Integration, HDP '07
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Title
International Symposium on High Density Packaging and Microsystem Integration, HDP '07
Titel Supplements
26 - 28 June 2007, Shanghai
Verlag
IEEE Service Center
Verlagsort
Piscataway, NJ
Datum
2007
ISBN
1-424-41253-6
1-424-41252-8
Konferenz
International Symposium on High Density Packaging and Microsystem Integration 2007
