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Title
IEEE/ACM International Conference on Software and System Processes, ICSSP 2019. Proceedings
Title Supplement
25-25 May 2019, Montreal, Québec, Canada
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2019
ISBN
978-1-7281-3393-5
978-1-7281-3394-2