Title

25th International Workshop Thermal Investigations of ICs and Systems, THERMINIC 2019

Title Supplement

25-27 September 2019, Politecnico di Milano, Lecco, Italy

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2019

ISBN

978-1-72812-078-2

978-1-72812-079-9

Conference