Title

EPTC 2008, 10th Electronics Packaging Technology Conference

Title Supplement

9th-12th December 2008, Singapore

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

New York, NY

Publication Date

2008

ISBN

978-1-4244-2117-6

978-1-4244-2118-3

Conference